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Substrate option: |
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IT-180ATC laminate / IT-180ABS prepreg |
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S1170 laminate / S0701 prepreg |
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IT-180A is an advanced high Tg (175℃ by DSC) multifunctional filled epoxy with low CTE, high thermal reliability and CAF resistance. It’s design for high-count layer PCB and can pass 260℃ Lead free assembly and sequential lamination process. |
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S1170 is a lead-free compatible FR-4 laminate, DSC high Tg 170℃. It has excellent thermal stability and anti-CAF performance, low Z-axis CTE and low water absorption. S0701 is the bonding prepreg for S1170, DSC high Tg 170℃. It has excellent adhesion property and PCB processability. |
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Available in Variety of Constructions |
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Available in a various of constructions, copper weights and glass styles, including standard(HTE), RTF and VLP copper foil. |
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Applications |
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Multilayer and high layer PCB |
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Heavy copper applications |
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Backplanes |
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Computer and peripherals |
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Automobile |
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Servers and Networking |
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Telecommunications |
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Remote broadcast |
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Data storage |
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IP codecs |
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NATA |
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communication systems |
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